Accessory Compatibility
Recommended | Not Recommended | |
Build Plate | Engineering Plate, High Temperature Plate or Textured PEI Plate | Cool Plate |
Hotend | All Size / Material | / |
Glue | Glue Stick | Bambu Liquid Glue |
RFID for Intelligent Printing
All printing parameters are embedded in RFID, which can be read through our AMS (Automatic Material System).
Load and print! No more tedious setting steps.
Recommended Printing Settings | |
Drying Settings (Blast Drying Oven) | 80 °C,8h |
Printing and Keeping Container’s Humidity | < 20% RH (Sealed, with Desiccant) |
Nozzle Temperature | 250 – 270 °C |
Bed Temperature (with Glue) | 90 – 110 °C |
Printing Speed | < 300 mm/s |
Physical Properties | |
Density | 1.20 g/cm³ |
Vicat Softening Temperature | 119 °C |
Heat Deflection Temperature | 117 °C |
Melting Temperature | 228 °C |
Melt Index | 32.2 ± 2.9 g/10 min |
Mechanical Properties | |
Tensile Strength | 55 ± 4 MPa |
Breaking Elongation Rate | 3.8 ± 0.3 % |
Bending Modulus | 2310 ± 70 MPa |
Bending Strength | 108 ± 4 MPa |
Impact Strength | 34.8 ± 2.1 kJ/m² |
Downloads
Printing Tips
• Due to the transparent properties of the filament, Lidar Extrusion Calibration can be affected when printing Transparent PC.
• Bambu PC needs proper drying before printing, recommended drying temperature is 80 ℃ for 8 hours in a blast drying oven, or 100 ℃ for 12 hours on a printer’s heatbed. For more details please refer to: Filament drying coveron WIKI.
What’s in the Box
Filament*1 & Desiccant*1
Package*1
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